2024.04.11 更新
OpenPack: A Large-scale Dataset for Recognizing Packaging Works in IoT-enabled Logistic Environments
著者名 | Naoya Yoshimura, Jaime Morales, Takuya Maekawa, and Takahiro Hara |
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雑誌名 | IEEE Int'l Conf. on Pervasive Computing and Communications (PerCom 2024) |
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発行年 | 2024 |
頁 | 90–97 |
URL | https://doi.org/10.1109/PerCom59722.2024.10494448 |
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