Apr. 11th 2024 update
OpenPack: A Large-scale Dataset for Recognizing Packaging Works in IoT-enabled Logistic Environments
Authors | Naoya Yoshimura, Jaime Morales, Takuya Maekawa, and Takahiro Hara |
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Journal | IEEE Int'l Conf. on Pervasive Computing and Communications (PerCom 2024) |
Volume | |
Year | 2024 |
Pages | 90–97 |
URL | https://doi.org/10.1109/PerCom59722.2024.10494448 |
Other |